Chips could run faster and be more energy efficient thanks to a process from IBM that copies nature's creation of seashells and snowflakes.
The process, called airgap, enables trillions of microscopic vacuum holes to be placed between the copper wire in chips to act as an insulator.
It solves the problem of electrical energy leaking between wires, which creates unwanted heat.
IBM says the chips will run 35% faster and consume 15% less energy.
The company has developed a method of controlling the interaction between self-assembling molecules, called diblock copolymers, to create the vacuum holes.
Lol, at least they now seem to have found a cure for the energy leaks but what a weird way to do it. Either way though, maybe we will finally break the 4.0Ghz barrier... BBC News Report